PCB substrates are generally classified by the insulating part of the substrate. Common raw materials are electric wood boards, fiberglass boards, and various types of plastic boards. Manufacturers of PCBs generally use an insulating part composed of glass fiber, non-woven material, and resin, and then press it into a "prepreg" with epoxy resin and copper foil.

The following problems may occur in the substrate during the PCB design process.

Symptoms of various soldering problems: There are blast holes in cold solder joints or solder joints.

Inspection method: The hole is often analyzed before and after dip soldering to find out where the copper is stressed. In addition, the raw material is subjected to the feed inspection.

The copper-clad board must be inspected before the warehouse is inspected. Check whether the board surface has scratched or exposed substrate. If it is necessary, contact the supplier in time and make appropriate treatment according to the actual situation. Visit here: https://www.uetpcb.com/faq.html