This type of silicon parts is made by single or multi-crystalline silicon ingot materials. The outside diameter of the silicon ring is up to 650mm. The silicon ring is used in the dry etching machine as the focus ring, outer electrode, confinement ring.

Features of DSTC Silicon Ring

1

Establishment of plasma etching condition.

2

Use as electrodes for RF units.

3

Control sidewall damage of the reactive substance, improve etching aspect ratios and optimize etching surfaces.

4

Improve the uniformity and yield of the edge of silicon wafer.

Why Choose DSTC Silicon Rings in Semiconductor Manufacturing?

1. Used as electrodes in CCP/ICP etching equipment to focus and drive plasma for wafers;

2. Silicon rings can optimize etching performance/uniformity at the edge of wafers.

Silicon Ring Gallery

The Silicon Ring is used in the dry etching machine as the outside electrode or the lower electrode.

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