Silicon Injector

The Silicon Injector is a crucial component in the heat treatment process and deposition of silicon wafers, directly impacting their heat treatment effectiveness and deopsition performance. Heat treatment of silicon wafers plays a vital role in semiconductor and integrated circuit processing, with its outcome closely tied to the final performance of the wafer.

Silicon heat treatment encompasses oxidation, diffusion, annealing, and other processes. During this procedure, semiconductor silicon must be placed inside the furnace body, requiring a pipeline for gas entry into the furnace body known as the silicon Injector.

Applied to HP and deposition equipment, silicon nozzle injector is a key component to deliver chemical gases. The deposition thickness is up to 300μm, 10 times of that of quartz injectors.

Features of DSTC Silicon Injector

1

Adopt integrated drilling process.

2

Realize customized processing of any length.(3-14mm aperture)

3

High purity of raw materials.

4

High metal contamination control to meet the requirements of the silicon wafer treatment process.

5

Same coefficient of the thermal expansion.

6

The deposition thickness is up to 300μm, 10 times of that of quartz injectors.

Specifications of DSTC Silicon Injector

Product Length 100mm-1400mm

Aperture Size 4mm-12mm

Product Structure Welded, Integrated, Threaded Connection

Conductive Type/Doping Custom

Resistivity Low Resistance (E.G.