Export Loadpoint is committed to developing new machines and process techniques to suit market demand world wide for semi conductor . Contact Loadpoint directly for guidance on representation globally - support is available world-wide. Loadpoint has been providing solutions for the Semiconductor/Electronics Industry and related industries for over thirty seven years, with a commitment to developing new machines and process techniques to suit market demand world wide. Loadpoint Incorporates four main product/service groups into its portfolio as follows: 1. Machine Tools - NanoAce and MicroAce dicing machines; Grinding machines - PicoAce and NanoAce 2; Drilling/Milling machines - NanoAce, a high precision machine tool suitable for the latest components produced by the Electronics/Semiconductor and related industries; Washpoint wafer washing station 2. Loadpoint Bearings - products includes Dicing spindles; Diamond turning spindles; Paint spraying spindles; Rotary tables; Grinding/Industrial spindles; Linear/air & hydrodynamic bearings; Drives - AC and DC brushless drives for both air and ball bearing spindle types 3. Loadpoint Technologies - includes materials processing technologies; development; micromachining and subcontract services (dicing, grinding, thinning, drilling, milling, slotting, chamfering, profiling and local area polishing all with post-process cleaning) 4. Loadpoint Electrochemical Micromachining (EMM) - Loadpoint has developed an Electrochemical Micromachining process suitable for generating a variety of shallow features on all types of bearing surface All of the above is complimented by outstanding after sales service and support programme.