As one of turnkey PCB assembly suppliers, turnkey PCB assembly factories, turnkey PCB assembly manufacturers, we can do SMT and THT assembly on the same board and rich expertise like smartphone accessories, hardware, led lighting products etc.

Mixed PCB Assembly is a combination of through-hole and surface-mount PCB assembly techniques when filling boards.

The requirement of turnkey PCB assembly China is generated because some parts in the surface mount configuration are not available. Therefore, Mixed PCB Assembly arises at the right moment to solve this problem.

At Fastlink Electronics, the China turnkey pcb assembly factory, turnkey pcb assembly manufacturer, the combination of through-hole and surface mount PCB assembly technology is a very mature technology, you just give us your design, we will take care of the rest and providing you with the perfect product.

Types of components used in mixed PCB assembly

Mixed PCB assembly involves the use of different types of components to create a circuit board with a mix of through-hole and surface-mount technology. Here are some of the types of components commonly used in mixed PCB assembly:

Through-Hole Components

These are the components that have leads that pass through holes in the PCB and are soldered to pads on the other side of the board. Through-hole components have been used in electronic circuits for many years and are still used in many applications due to their durability and reliability.

Surface-Mount Components

These are the components that are mounted directly onto the surface of the PCB and do not require holes to be drilled into the board. Surface-mount components are smaller and more cost-effective than through-hole components and are commonly used in modern electronics.

Ball Grid Array (BGA) Components

These are surface-mount components that have an array of small solder balls on the underside of the package. BGA components are used in high-density designs where a large number of connections are required in a small area.

Chip-Scale Packages (CSPs)

These are surface-mount components that are similar to BGAs but have a smaller footprint and a higher pin count. CSPs are used in applications where board space is at a premium.

Dual In-line Packages (DIPs)

These are through-hole components that have two parallel rows of pins that extend through the PCB. DIPs are commonly used in older electronic designs and in applications where through-hole components are preferred over surface-mount components.