Disco Dicing Blade

Our Disco diamond blade with Hub is with a stronger edge, which makes the blade more rigid and keeps the edge not to be broken, so the cutting with the blade is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.

E grind, as an excellent cbn grinding wheel suppliers, offers a wide range of metal bond diamond wheel for you to choose from.