The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.

Performance of Dicing Blades Without Hub

Strong cutting ability

High accuracy

The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm

Applications of ultra thin diamond blade Without Hub

For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.

E grind, as an excellent diamond wheel manufacturer, offers a wide range of resin bonded grinding wheels for you to choose from.