Disco Diamond Blade

Our Disco dicing blade with Hub is with a stronger edge, which makes the diamond blade disco more rigid and keeps the edge not to be broken, so the cutting with the disco saw blades is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.

Specifications of disco dicing saw blades With Hub

Product Specification

Available shape 14A1

Working Condition

Grinding Type Wet

E grind, as an excellent grinding stone manufacturer, offers a wide range of metal bonded diamond grinding wheels for you to choose from.